The Kester Easy Profile 25670-0102-0511 No-Clean Soldering Paste is designed for maximum robustness in air or nitrogen reflow profiling and printing.
Kester 70-0102-0511 Features:
For Stencil Printing Applications
Contains the widest possible reflow processing window
Capable of printing downtimes of up to 90 minutes with an effective first print down to 20 mils
Tin/lead alloy: Sn63/Pb37;
Powder mesh size: -325/+500 (Type 3)