A 2 mil commercial grade Kapton alternative Polymide film coated with a high performance silicone adhesive. Thin and conformable with outstanding tear and abrasion resistance at elevated temperatures. Adhesive will thermoset to increase adhesion values. Leaves minimal residue when removed after manufacturing process; reduces clean-up time and minimizes rejects. Permits observation of board during processing. Excellent resistance to acids, oils, solvents, aging, staining, water immersion. Protects gold contacts from molten solder during hot air wave solder leveling process. Film meets UL510. 3" plastic core.APPLICATIONS: Masking applications where very high temperatures are involved. Used to protect gold contacts from molten solder during wave soldering process. Wrapping and fixing of electronic components, coils, generators, transformers, etc.PHYSICAL PROPERTIES:Backing2.0 mils (0.050 mm) Polyimide FilmAdhesiveTransparent High Temperature SiliconeTotal Thickness3.5 mils (0.090 mm)Adhesion27.4 oz/inchTensile Strength36.5 lbs/inchElongation70%Temperature Resistance392F (200C) / 30 minInsulationClass HDielectric Strength8000 VFilm ColorAmber (transparent) Alternative to: Bondtec #911-325; Electro Tape #95-2; Anchor #K-350; American #304-2; Permacel #P-222; T&F #3903; Taconic #6325-02; Berry Plastics #2345-2; Tesa #4429; Ideal #9322; Solar Plus #KA105#50; Dewal #303-2.Note: The physical properties listed above are typical test results obtained from a series of laboratory tests and should not be used for the purpose of writing specifications. Before using this product, user shall determine the suitability of the product for his/her use; and user assumes all risks and liabilities in connection therewith. All test procedures used are in accordance with ASTM and PSTC methods.
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